Characteristics and the design principle of the cylindrical planar magnetron sputtering target

Troubleshooting for magnetron sputtering film

Grey and black film

(1) vacuum degree lower than 0.67Pa. The vacuum was increased to 0.13-0.4Pa.

(2) argon purity less than 99.9%. Should be replaced with the purity of 99.99% argon.

(3) the inflation system leak. Should check the inflation system, eliminate the leakage phenomenon.

(4) not fully cured primer. The curing time should be appropriately extended primer.

(5) plating outgassing amount is too big. Will be dried and sealing treatment

The film surface luster dim

(1) primer curing or deterioration. The curing time should be appropriate to extend the primer or replace the primer.

(2) the sputtering time is too long. Should be appropriate to shorten the.

(3) the sputtering rate too fast. Should be appropriate to reduce the sputtering current or voltage

The film uneven color

(1) the primer is not uniform. Methods of applying primer should be improved.

(2) film is too thin. Should be appropriate to increase the sputtering rate or the increasing of sputtering time.

(3) the fixture design is not reasonable. Should improve the fixture design.

(4) plating geometry is too complex. Should be appropriate to increase the speed of rotation plating

The film wrinkling, cracking

(1) primer spraying too thick. Should be controlled at 7 - lOtan thickness range.

(2) the coating viscosity is too high. Should be appropriate to reduce the.

(3) the evaporation speed is too fast. Should be appropriate to slow down.

(4) film is too thick. Should be appropriate to shorten the sputtering time.

(5) the plating temperature too high. Should be appropriate to shorten the heating time of plating

The film surface traces of water and dust, fingerprints

(1) plating after cleaning is not fully dry. Should strengthen the treatment before plating.

(2) the plated surface splashing water or saliva. Should strengthen the civilized production, the operator should wear masks.

(3) primer after contact with plating, surface leave fingerprints. Should be strictly prohibited to touchthe plated surface.

(4) a particulate coating. Should filter coating or replacement of coating.

(5) there are particles of dust electrostatic precipitator failure or spraying and curing environment.Replace the filter, and keep the working environment clean and tidy

Film adhesion adverse

(1) plating oil removal is not thorough. Should strengthen the treatment before plating.

(2) the vacuum chamber is not clean. Cleaning vacuum chamber. Notable is, in the process ofinstallation and dismantling target target, prohibit the use of hand

Or not clean object in contact with a magnetron source, in order to ensure cleanliness of magnetronsource has high, this is to improve the film adhesion of

To be one of the measures.

(3) the fixture is not clean. Clean fixture.

(4) the improper selection of bottom coating. Replace the paint.

(5) the improper control of the sputtering conditions. Sputtering process conditions should be improved

Characteristics and the design principle of the cylindrical planar magnetron sputtering target

Abstract: This paper introduces a kind of method according to the principle and structural design ofcylindrical, rectangular planar target plane magnetron sputtering target. And how to play a cylindrical,planar magnetron sputtering target for the analysis of the merits.

Keywords: magnetron sputtering; target; vacuum coating

1 magnetron sputtering technology

Magnetron sputtering technology is a new type of sputtering technique developed in 70, is now in thescientific research and production application. The magnetron sputtering coating is mainly used in electronic industry, magnetic materials and recording medium, optical communication and etc., has the advantages of high speed, low temperature, low damage and other advantages. High speed is fast deposition rate; low temperature and low damage refers to the substrate temperature is low, little damage.

2 magnetron sputtering and magnetron sputtering target

The 2.1 principle of magnetron sputtering

2.2 important function of magnetron sputtering target in the coating process

Magnetron sputtering target is the core parts of the vacuum magnetron sputtering coating, its important role mainly in the following two aspects: (1) a large surface area for coating, magnetron sputtering target affects the uniformity and repeatability of film; (2) when the coating material forprecious metals, determines the structure of the target (target film forming material), using the precious metal.

3 common magnetron sputtering target and its advantages and disadvantages
3.1 rectangular planar target
Structure of rectangular planar target, the direction of the magnetic field and the target surface cathode parallel, forming an annular magnetic field, the magnetic field and electric field of E orthogonal. When the vacuum chamber is filled with argon, is ionization discharge, A+r ion bombardment cathode discharge (target) surface. Two E1 influenced by Lorentz force field B, movement along the direction perpendicular to the magnetic field lines (Fig. 3). These electronic motion path length, increase the gas molecular collision opportunity, make the probability of ionization gas increases, thereby increasing the sputtering rate.
The structure of rectangular planar target
Closed circular track the target surface by the magnetic field.
Characteristics of rectangular planar target is of simple structure, strong versatility, film uniformity and repeatability. But the disadvantages are the low ratio of target utilization, generally about 20% (about 2). When the glow region, the target that magnetic field distribution region of consumption to a certain extent, will form a bar-shaped pits, target material change thin, pit depth reaches a certain level, the target can not continue to use.
3.2 coaxial cylindrical magnetron sputtering target
Coaxial cylinder magnetron sputtering target, the magnetic lines of force parallel to the target surface, and orthogonal to the electric field of E. Plasma region of magnetic field and target surface enclosed space is confined electron movement. This area is an annular space, can be seen from the chart, the coaxial cylindrical magnetron sputtering target has a plurality of annular space.
The advantages of coaxial cylindrical magnetron sputtering target is compact in structure, the target utilization rate is flat rectangular target. But the disadvantage is high during sputtering, the target surface into a plurality of glow, can not form a continuous strip glow, so in the films of large area, uniform coating on the surface of the poor, it is difficult to to meet the requirements.
The design idea of 4 cylindrical, planar magnetron sputtering target
The 4.1 principle
The rectangular planar magnetron target structure principle is applied to the cylindrical magnetron sputtering target, sputtering target design called cylindrical, planar magnetron sputtering target. It has both the advantages of plane rectangular target and coaxial cylindrical target both. Namely, the uniformity of coating, and the target utilization rate is high.
The two rectangular plane target around the X axis (see Figure 2) curled into a semicircle, and the closure, as shown in Figure 5, which completed the initial plane rectangular target evolution of.X to the cylindrical, planar magnetron sputtering target shaft into the axis line, lines of the form 4 closed space in the cylinder on the surface, namely the constraint two electronic E1 motion of the plasma region.
4.2 technical problems to solve
In the process of the rectangular planar target into cylindrical, planar target, magnet along the X axis arranged in rectangular planar target becomes the magnet distribution along the axial direction of the cylindrical, planar target. And the end of the magnet A perpendicular to the X axis plane rectangular target in the end in theory, should be annular magnet A ring, and the magnetization direction should be the ring inner surface and the outer surface, namely the internal and external surface shall be respectively S and N poles, the magnetization method. However, it is almost impossible to design. Therefore, cylindrical, planar magnetron sputtering target, both ends of the magnetic field problem is solved successfully. The key.
Using the principle of magnet and a pole shoe coaxial cylinder magnetron sputtering target, namely with annular magnets magnetized in the axial direction (two end surfaces are respectively S and N poles), in the annular "end with a magnetic material make the pole shoe", according to the characteristics of magnetic field distribution along the surface of the magnetic line of force is: at this time round surface emission along the "pole", namely "shoe" instead of a magnetic poles of the magnet. "Shoe" the outer circle surface emission lines, the directions of magnetic lines of force coincided with the ideal ring magnet wanted the same. Therefore, using the principle of magnet and a pole shoe coaxial cylinder magnetron sputtering in the target connection problems can be resolved, cylindrical, planar magnetron sputtering target end magnetic field and magnetic field.
Cyclic corrosion pit plane rectangular target
Cyclic corrosion pits cylindrical, planar magnetron target

Comparison of the 5 cylindrical, planar magnetron sputtering target and the rectangular target working condition
Plane rectangular target is formed on the surface of the target of a toroidal glow closed belt, with target consumption, to form a cyclic corrosion pits correspond to glow in the target surface (Fig. 8).
Cylindrical, planar magnetron sputtering target two groups were formed on the surface of the target (four) symmetric closed annular glow zone, with target consumption, will form a cyclic corrosion pits correspond to glow in the target surface (Fig. 9).
The 6 cylindrical, planar magnetron sputtering target advantage
Compared with other forms of magnetron sputtering target, cylindrical, planar magnetron sputtering target in the rectangular planar target coating has the advantages of good uniformity at the same time, through the following two ways to maximize the utilization rate of the target, (1) when the surface of the target group 2 (four) circular pit to a certain depth when, can be the target core (magnet) relative to the target tube to rotate 45 degrees, so that you can use to target tube also no corrosion area; (2) the target core design when the cylindrical, planar magnetron sputtering target into a rotating target core, (sputtering target core in a rotating), can be the target surface with a layer of a layer of evenly sputtered out, without generating pit, at this time, the target will be the most effective use, and the utilization rate of the target can be up to 50% ~ 60%. when the target is precious metal materials, it is undoubtedly of great significance (2).
7 conclusion
To solve the end magnetic field problem through the principle of the magnet and the boots of coaxial cylindrical magnetron sputtering target, the target turns into a cylindrical, rectangular planar magnetron sputtering target. The target is retained in the rectangular planar target coating uniformity is good, can maximize the utilization rate of the target to improve the economic benefits..